Finite element analysis of the temperature dependent conductivity of metallic hollow sphere structures
DOI:
https://doi.org/10.1260/175095407782219229Abstract
In the scope of this study, finite element analysis is applied in order to determine the effective thermal conductivity of periodic metallic hollow sphere structures (MHSS). Two different joining technologies for the connection of the hollow spheres, namely sintering and adhesive bonding, are considered. For the determination of the thermal conductivity of the MHSS, the temperature dependence of the thermal conductivities of the base materials, i.e. hollow spheres and joining element, are considered. Two different cases, a low and a high temperature gradient within the structure are distinguished. Furthermore, the overall thermal conductivities of sandwich panels with an insulating MHSS core in dependence on the relative face sheet thickness are investigated.
References
Degischer, H., Kriszt, B., Handbook of Cellular Metals, Wiley-VCH, Weinheim, 2002.
Ashby, M.F., Evans, A., Flech, N.A., Gibson, L.J., Hutchinson, J.W. and Wadley, H.N.G., Metal Foams — A Design Guide, Butterworth-Heinemann, Woburn 2000.
Lu, T.J., Thermal Transport and Fire Retardance Properties of Cellular Aluminium Alloys, Acta Materialia, 47, pp. 1469–1485. https://doi.org/10.1016/s1359-6454(99)00037-3
Öchsner, A., Grácio, J., On the macroscopic thermal properties of syntactic metal foams., Multidiscipline Modelling in Materials and Structures, 2005, 1, pp. 171–181.
NIST Cryogenic Technologies Group, Bolder CO, Military-Handbook-5H, 1998, pp. 3–261.
MSC.Marc, Material Database.
Nyilas, A., Rehme, R., Wyrwich, C., Springer, H. and Hinrichsen, G., Thermal diffusivity and conductivity of highly filled epoxies as cover materials for microelectronical devices as measured by the heat pulse technique, Journal of Materials Science Letters, 1996, 15, p. 1457. https://doi.org/10.1007/bf00275305
Technical Data Sheet, Loctite®.
Published
How to Cite
Issue
Section
Copyright (c) 2007 T Fiedler, A Öchsner

This work is licensed under a Creative Commons Attribution 4.0 International License.